ATS achieves manufacturing efficiency through continuous improvement involving a combination of Lean, Six Sigma and other methodologies. Key process indicators are used throughout the business, from engineering to quality assurance to manufacturing, they are monitored, and action plans are established and executed. Our flexible approach allows us to meet your requirements through either firm order or a Kanban Pull System.

Our Capabilities:

  • Low & Medium Volume/High Mix/High Complexity/High Reliability Production
  • Complete Tin-Lead And Lead Free (RoHS) Manufacturing Capabilities
  • PCB Assemblies – SMT, PTH & Mixed Technology
  • Rapid Prototyping – Turnkey or Consigned
  • Rapid Changeover Capability
  • Box Build & System Integration
  • BGA & Micro BGA Rework and Repair
  • Rework, Repair & After Market Support

Our Technologies:

  • SMT down to 0201
  • Flex & Rigid Flex
  • BGA and Micro BGA down to 0.5mm
  • Flip Chip/CSP
  • PoP & RF
  • SPI, Flying Probe & AOI
  • ICT, CFT & Programmable X-Ray Inspection with Rotation Capability
  • Conformal Coating
  • Selective Soldering
  • Board/Array Size – 2” x 2” Up to 12” x 18”
  • PTH Automation – DIP/ Axial & Radial